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Diam Thermal Conductive Heatsink Plaster Viscous Adhesive Compound Glue for PC GPU IC Accessories

Current price

Price €16.41

VAT and duties included

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Delivery to Austria

Est. 0 business days · € 5 per order

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Manufacturer

Characteristics

Country of manufacture

China

Description

Specifications: Heatsink Plaster Thermal Conductive Glue. Thermal properties, strong adhesion. Viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels.

Type: Heatsink Plaster Melting Capacity: 0 (200 Degree Celsius/ 24Hours) Evaporation: 0.001% (200 Degree Celsius/ 24Hours) Thermal Conductivity: > 1.2W/m-K Thermal Impedance: < 0.06 Clotting time: 3min (25 Degree Celsius) Strength of Connected Buildings: 25kg Insulation Coefficient: > 5.1 Dissipation coefficient:

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ANBS

4.6

10.000+

reviews

30.000+

purchases

Seller's info and responsibility

EU Responsible Person

Reviews 26

4.7

Customer

April 24, 2025

Ok.

Customer

April 24, 2025

Ok.

Customer

March 7, 2019

It took about a month. The packaging was not damaged, everything is ok. The tube is 5 grams (I expected it to be the same size as in the photo))))

Customer

January 8, 2019

Customer

October 15, 2025

Haven't used yet

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