Silicone Baseds Thermals Conductivity Pad for Electronics Cooling Long Heat Transfer Materials

Features: high Thermals conductivity, allowing the device to quickly cool down and preventing gamers from experiencing high frequency lag. for various, including graphics card memory bridge, RDRAM memory module, communication devices, SSDs solidstatedrive, automotive control devices, and game console equipment. Insulation is nonconductive and not damage electronic components. Multiple thickness available for cutting. Good elasticity and compressibility can perfectly fill electronic components for air strikes, maximizing Thermals conductivity efficiency.

Specifications: Thermals conductivity: 12.8Wmk Color: Gray Density (): 3.1 ± 0.2 Hardness (): 30-55 Specification: 85x45mm Breakdowns voltages: 9.8KV Conductivity: No Harmlessness: Yes Thickness of Thermals pad: 0.5/1/1.5/2/2.5/3mm(optional)

Package Includes: 1PC Thermals Pad

note: Please allow 1-3cm error due to manual measurement. make sure you not mind before bid. Due to the differences between different monitors, the picture may not reflect the actual of the item.