High-temperature solder paste 217°C (Sn99%Ag0.3%Cu0.7%), electronic solder paste, used for IC/PCB/BGA/SMD/repair with melting point of 217°C, no-clean

Achieve flawless soldering with our high-temperature solder paste, designed for demanding electronic applications. Perfect for applications requiring elevated heat resistance, this lead-free, RoHS-compliant solder paste ensures reliable connections and long-lasting performance. Ideal for industrial, automotive, and aerospace electronics manufacturing. Key Features: High-Temperature Resistance: Suitable for processes exceeding 250°C Lead-Free & Eco-Friendly: Compliant with RoHS standards Excellent Solderability: Ensures quick, clean, and strong bonds Stable Performance: Maintains viscosity and solderability over time Wide Application Range: Perfect for PCB assembly, automotive, and aerospace industries Usage Instructions: Apply evenly using a stencil or syringe, then reflow at the specified temperature to achieve optimal solder joints. Store in a cool, dry place for maximum shelf life. Package Details: Available in 10g, 30g, 50g syringes, or bulk containers. Safety & Handling: Use in a well-ventilated area. Avoid contact with skin and eyes. Wash hands thoroughly after use.